Heat dissipation and thermal expansion mismatch are extremely important issues in many electrical and electronics applications, and the materials used for thermal managementin such applications have attracted a great deal of attention in recent years. The move in the microelectronics industry toward higher circuit board chip densities and packageless chip designs such as flip chips has prompted the need for improved thermal management materials. If heat extraction and thermal expansion are not properly addressed, thermal mismatch among the materials in electronic assemblies may lead to high interfacial shear strains and premature component failure.